5/10/30g 1.93W/mk HY510 Silicone Thermal Paste Heat Sink Thermal Transfer Grease Cooling Syringe for CPU GPU Chipset Laptop

HY510 Silicone Thermal Paste is designed to improve thermal conductivity between electronic components such as CPUs, GPUs, and chipsets and their heat sinks. With a thermal conductivity greater than 1.93W/mk, it ensures efficient heat transfer, helping to keep components at optimal operating temperatures. This thermal paste is available in 5g, 10g, and 30g syringes, allowing for precise application tailored to specific needs.

Specifications

• Brand: Haykea
• Origin: Mainland China
• Model: HY510
• Thermal conductivity: >1.93W/mk
• Thermal impedance: <0.225℃-in²/W
• Specific gravity: >2g/cm³
• Viscosity: 1000
• Thixotropic index: 380#1/10mm
• Working temperature: -30~280℃
• Storage temperature: -50~300℃
• Color: Grey
• Available volume: 5g, 10g, 30g

Composition

• Silicone compounds: 50%
• Carbon compounds: 30%
• Metal oxide compounds: 20%

Application methods

1. Center Point Method: Apply a small amount of thermal paste to the center of the CPU/GPU surface, then spread it evenly by pressing with the heat sink. This method is ideal for small areas.

2. Spreading Method: Spread the thermal paste evenly over the entire surface of the CPU/GPU. This method is best suited for large areas, but requires special care to avoid introducing dirt or air bubbles.

Recommended use
HY510 thermal paste is ideal for CPUs, GPUs, chipsets, and other components requiring efficient heat dissipation in desktop and laptop computers.